solder

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sol·der

(sod'ĕr),
1. A fusible alloy used to unite edges or surfaces of two pieces of metal of higher melting point; hard solders, usually containing gold or silver as their main constituent, are usually used in dentistry to connect noble metal alloys.
2. To join two pieces of metal with such an alloy.
[L. solido, to make solid, through Fr., various forms]

solder

[sod′ər]
Etymology: L, solidatio, making solid
1 n, a fusible metal or alloy used to unite pieces of metals with higher fusion temperatures.
2 v, to fasten together pieces of metal through the use of this material.

sol·der

(sod'ĕr)
1. A fusible alloy used to unite edges or surfaces of two pieces of metal of higher melting point; hard solders, usually containing gold or silver as their main constituent, are frequently used in dentistry to connect noble metal alloys.
2. To join two pieces of metal with such an alloy.
[L. solido, to make solid, through Fr., various forms]

solder (sod´ur),

n a fusible alloy of metals used to unite the edges or surfaces of two pieces of metal.
References in periodicals archive ?
In agreement with valid legislation in EU, the solders containing lead and/or cadmium must not be used in electric equipment.
Complete evaporation of the solvent is important to reduce soldering defects such as openings, voiding, and solder balling.
In contrast, mechanical stress does not play a role so that weakly adhesive peelable solder masks can be used.
The lead solders were for a long time employed in industry owing to their optimum soldering properties and a low price.
SnAgCu (or SAC), the most common lead-free solder alloy, has a higher melting point than SnPb solder, which increases the thermal demands on certain processing equipment.
It then gets into the pumped solder as it is being delivered into the nozzle.
Again, a typical reflow soldering thermal profile for SnPb solder has a peak temperature of approximately 220 [degree]C- just above the 217 [degree]C melting point of SAC 305 and less than the recommended peak temperature of 240 [degree]C for this alloy.
As in all soldering processes, the flux and its activity at the higher solder temperatures (as well as the nitrogen atmosphere) may provide improvements, since these parameters influence oxidation and solder surface tension.
Lead-free DOFLUX meets the need for hot-air levelling fluxes that can activate the new solder coatings at these higher temperatures.
For SnPb solders, 245-250[degrees]C is a common setting; for SAC-alloys, 260-265[degrees]C is the recommended setting.
For electronic equipment, lead is used in solders when mounting components on a circuit board.