BGA

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BGA

Abbreviation for:
Bermuda grass allergen
blood-gas analysis
blood-group antigen
brilliant green agar
References in periodicals archive ?
C4NP: Lead-Free and Low Cost Solder Bumping Technology for Flip Chip and WLCSP"
Solder bumping onto a socket is performed by printing paste or pin-transfer flux onto the pin head, followed by solder ball placement and reflow.
one of the world's largest semiconductor packaging and testing companies, has completed the development of its 300mm wafer solder bumping technology.
Among the various methods of solder bumping processes, electro-deposition is increasingly becoming the preferred method, especially for fine-pitch applications.
This technology offers FlipChip International's customers a lower cost alternative to its thin film sputtered metallization and is complimentary to its diverse solder bumping technologies and wafer level packaging solutions.
Wafer-level solder bumping was used to prepare ICs for flip-chip attach (FCA) to a multi-chip module (MCM).
The ABA process decreases the size of Nextreme's thermal bumps to approximately 125 microns, which makes them flip-chip bumping compatible with standard solder bumping processes commonly used in electronics packaging.
Both gold bumping and solder bumping services are available for customers' advanced packaging technology requirements.
The inherent cost advantages, flexibility, and ease of use make SUSS production lithography systems extremely attractive solutions for different wafer level packaging technologies, including solder bumping, gold bumping, redistribution layers (for wafer level packages and chip stacking) or re-passivation.
IBM's Peter Gruber has conceived a new solder bumping method that builds on the controlled collapse chip connect invention yet eliminates several steps--including all mold cleaning.
Unitive services include multi-level passivation and thin film wiring, solder bumping and chip scale packaging.
BOC has partnered with Shinko Seiki, a leading supplier of plasma and vacuum soldering systems in Japan, to assist chip manufacturers with void-free and flux-free advanced solder bumping.