BGA

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BGA

Abbreviation for:
Bermuda grass allergen
blood-gas analysis
blood-group antigen
brilliant green agar
References in periodicals archive ?
When the component or solder ball is touched to the PCB, it will not move due to surface tension differences.
The solder balls are self-centering (up to 50% off the pad) during reflow, decreasing placement issues.
The collaborative efforts have successfully produced solder balls of industrial specification with diameters of 0.
First, probe guiding needed improvement to enable test probes to strike the center of each test pad and reduce--if not eliminate--their natural tendency to deflect from the dome of each solder ball.
This is then processed through a reflow oven using an appropriate thermal profile for the solder ball alloy.
This is logical, as these are intermetallic regions on the surface of the solder ball.
In the connector assembly process, stamping a Solder Charge is less expensive and more precise than melting a solder ball onto a metal lead.
For example, the operator presets their profile to accommodate a eutectic paste alloy, while applying a SACB (SnAgCuBi) solder ball, resulting in a non-collapsed BGA (Figure 1).
6Cu solder ball constitutes 75% of the final solder in the joint, the average composition of the solder in the ball and paste is Sn9Pb2.
The newer product's design provides balanced contact in the top hemisphere of the solder ball, reducing shear stress on the solder ball and minimizing package shift during actuation.
Solder ball attachment to BGA and CSPs is seldom performed without at least some negative impact on component reliability.