BGA

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BGA

Abbreviation for:
Bermuda grass allergen
blood-gas analysis
blood-group antigen
brilliant green agar
References in periodicals archive ?
SAC BGAs need a hotter profile in order to collapse the SAC solder balls.
Ensuring use of the correct solder ball sizes/volume of solder is critical to ensuring all solder joint criteria for this device body style can be met.
This gave us 4800 opportunities for solder balls per paste type.
When comparing the [micro]PILR contact profile to the more common solder ball connections, the contact geometry is significantly smaller in both diameter and height, enabling a much lower finished package profile.
The spring probe interconnects (Figure 4) used in these sockets generally have lower contact resistance characteristics, higher resulting normal force to BGA solder balls, and are much more durable as compared to the contacts used in burn-in sockets.
Refraining from using soldermask will usually eliminate the problem of solder ball adhesion, but is not always a viable option.
Soldering a head slider to a tongue surface can be achieved by using gold ball bonding (GBB) or solder ball bonding (SBB).
Nordson DAGE a division of Nordson Corporation reports that several leading manufacturers of complex multi-layer printed circuit boards have adopted the company s hot pin pull test method for checking the integrity of solder ball attach on packages and printed circuit boards in accordance with the industry standard IPC9708.
In an overview of the Products of the Year Awards in the January issue of Electronic Products, Managing Editor Bryan DeLuca stated: 'Molex's Solder Charge surface-mount attach technology is more precise than melting a solder ball onto a metal lead.
The MicroImpact tester strikes a solder ball at a high rate of speed while simultaneously measuring force and displacement.