The physical and informational material that contains and/or accompanies a marketed or investigational therapeutic agent once it is fully prepared for release to patients and/or subjects in a clinical study.
With its specialized workflow that makes the tool easy to use and deploy, XtractIM is ideal for package design team engineers involved in modeling and characterization who need to provide IBIS (I/O Buffer Information Specification) models or SPICE circuit netlists to their customers and/or other internal groups such as IC groups or reference board design groups.
Historically, packaging machines were built to run one package size for long periods; however, the continual market drive for more new products and outlets has caused consumer goods companies to demand more flexible, lower-cost packaging machines that can speed time-to-market and optimize equipment use.
This integration addresses the need for engineers to consider package requirements during chip design because of increased semiconductor complexity and the emergence of new technologies, such as SiP emerge.
The development of sensors and electronics such as thin film transistors based on thin-film silicon fabricated directly (with appropriate coating) on packaging materials such as paper and plastic can also allow active monitoring of freshness and state of product and display information on the package.