When inspecting heavy wall pipelines in particular, the SIC measurement provides precise depth-sizing results for shallow internal corrosion (detection threshold [greater than or equal to] 1 mm) while assisting MFL defect identification and depth sizing by permitting better distinction of individual pits in dense clusters due to its high lateral resolution
in defect surface measurement.
perpendicular to the mucosa) is necessarily less than the lateral resolution
(tangential to the mucosa) because of the physical properties of confocal microscopes.
The highly focused x-ray beam allows a lateral resolution
of about 30 microns.
Avoiding wavelet stretch provides long-offset imaged data, far beyond what is reached in conventional migration and results in images from the target with improved vertical and lateral resolution
and angular illumination.
A closer inspection of the mid lane results in the finding of a significantly increased lateral resolution
of SIC related data.
The N-STORM instrumentation will be capable of multi-spectral two-dimensional and three-dimensional nanoscopy, with lateral resolution
to approximately 20nm and axial resolution to approximately 50nm, extending the role of the optical microscope to near molecular level resolution.
The lateral resolution
achieved can be well below 100 nm in some cases (8).
On the one hand, a FRT MicroProf confocal chromatic scanning microscope (CCSM; Fries Research and Technology GmbH, Bergisch Gladbach, Germany) with a lateral resolution
down to 1-2 [micro]m and a vertical resolution >10 nm was used.
On the other hand, using 3 foci instead of 1 will improve lateral resolution
of the image at several depths.
Other clinical benefits include uniform lateral resolution
over the entire depth and deeper penetration for imaging of the abdomen and other areas.
The ability to discriminate materials based on their mechanical properties, coupled with nanometer lateral resolution
, makes AFM the method of choice to characterize a variety of polymer materials including blends and composites.
The contributors present a new method to increase the lateral resolution
available in laser tools, through silicon circuit edit techniques, dynamic laser delay variation mapping implementations, and a robust system level failure analysis framework.