1, A is the AZ91D substrate and B is the Mg-Al intermetallic compounds
. The compositions of the intermetallic compounds
(B) were analyzed using XRD.
[Ni.sub.3]Al intermetallic compounds
are excellent candidates for high-temperature structural applications due to their thermochemical and mechanical properties.
Consequently, the control of the MA-aggregates features (chemical composition, microstructure, intergranular porosity, etc.) is crucial in order to elaborate intermetallic compounds
with expected properties.
There were more Ag and Cu atoms than Sn atoms in the solution at the initial reaction stage, and as a result of this, the coreduction of intermetallic compounds
, that is, [Ag.sub.3]Sn and [Cu.sub.6][Sn.sub.5], could take place.
The Intermetallic Compound
Formation at the Ti/Al Interface.
Phase 3 combined the information from Phase 1 and 2 with other studies to form a short list of Pb-free, minimally whiskering alloys and studied their intermetallic compound
(IMC) growth kinetics.
Paik et al., "Effects of Cu/Al intermetallic compound
(IMC) on copper wire and aluminum pad bondability," IEEE Transactions on Components and Packaging Technologies, vol.
, especially titanium aluminides, having a positive temperature dependence of yield strength are becoming one of the most promising candidates for a high-temperature material to realize an aerospace plane .
Predicted presence of intermetallic compound
was proved by light and electron microscopy analysis.
Recently, significant attention has been paid to high-entropy alloys because of their high mixing entropy and sluggish diffusion effects, which facilitate the formation of a single solid-solution structure of the alloy instead of a complex microstructure or an intermetallic compound
. As compared with conventional alloys, high-entropy alloys with an appropriate design exhibit superior performances.
Abstract: The effects of micro solder joint geometry on intermetallic compound
(IMC) growth and electromigration during thermal aging and current stressing have been investigated using three groups of specimens: sandwich structure with solder layer of 10 to 50pm, wire butt with solder layer of 60 to 240pm, and solder ball with diameter of 200 to 500pm, each having CuSnCu structure.
(The cellular structure had disappeared completely in the crack region.) However, under realuse conditions (mildly/nonaccelerated conditions), recrystallization was not observed in the solder interconnections, and cracks had propagated transgranuiarly in the bulk solder or between the intermetallic compound
(IMC) layer and the bulk solder.