coplanar

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co·plan·ar

(kō-plānăr)
Acting within the same plane.
[L. co- (com-), with, + planum, flat surface, plane]
Medical Dictionary for the Health Professions and Nursing © Farlex 2012
References in periodicals archive ?
This is because the common measurement of component warpage or coplanarity is performed at room temperature, while the dynamic component warpage behaves differently at the actual reflow temperature.
Abstract: The iNEMI PCB Coplanarity Working Group generated a snapshot in time of the dynamic coplanarity of several PCB designs from four market sectors.
* Board orientation-0[degrees], 45[degrees] or 90[degrees] can impact print quality, especially if coplanarity is poor.
An effective via-filling process ensures that vias are completely filled with the designated material, with no voids remaining and no surface residue, which may impair coplanarity. Voids are more serious; they not only compromise a via's conductive or insulating properties, but also trap air that will expand when the board is heated during the curing process or as the completed assembly is reflowed.
Bulky substituent disrupts the coplanarity of the polymer chain and increases the inter chain distance.
Abstract: With the advent of larger packages and higher densities/pitch, industry has been concerned with the coplanarity of the substrate package and PCB motherboard.
Coplanarity of the two packages, especially during reflow, was an issue in the early days, but a tremendous amount of work has been done to alleviate this problem.
Additional features include a guide box design that facilitates the alignment of the male pin into the female receptacle while protecting the pins from damage during board mating; high temperature LCP insulation with integral polarization keying features to prevent 180[degrees] out-of-orientation mismating; and process-proven .030" (0.76 mm) diameter solder balls that conform to industry standard BGA pad-to-ball ratios and compensate for minor board coplanarity, thermal expansion (CTE) and solder deposition variances.
The software detects, evaluates, and indicates failed solder joints including quality of heel fillet, side and toe fillet, bridges and electrical clearance, opens, side overhang, joint width and toe overhang, lead footprint, coplanarity, and voiding percentage.
In my opinion, the major disadvantage of (blind) via-in-pad is assembly: air getting trapped (voiding) and coplanarity are major issues.
The mechanical design eliminates any coplanarity issues that can result from handling.