BGA

(redirected from area array package)
Also found in: Encyclopedia.

BGA

Abbreviation for:
Bermuda grass allergen
blood-gas analysis
blood-group antigen
brilliant green agar
Mentioned in ?
References in periodicals archive ?
Abstract: The study investigates the impact of silicone and Parylene conformal coatings, epoxy underfill materials and a silicone sealant on a variety of area array packages while being subjected to thermal cycling.
For area array package repairs, medium wavelength IR systems provide ideal heat transfer and distribution, and are also flexible, user-friendly and cost-effective.
Increased use of area array packages, chip scale packages and flip chips demands it.
Area array packages with and without bumps have shown variations in performance and revealed the importance of placement pressure, placement speed and placement dwell in achieving low initial contact resistance.
Abstract: Backward compatible mixed-alloy soldering has been carried out on area array packages with Pb-free bumps and eutectic SnPb soldering paste.
This is an issue for portable devices employing area array packages such as BGAs and CSPs.
Abstract: Corner bond adhesive material has been widely used for improving shock performance of area array packages. Most of the studies focus on impact of material properties, such as CTE and Tg, on reliability at room temperature.
This is sufficiently accurate to detect fine-pitch components and all common area array packages.
Abstract: Celestica has been conducting an ongoing testing program to assess Pb-free compatible materials and area array packages against the currently accepted levels of process strain.
However, when building assemblies with area array packages containing SnAgCu balls with SnPb solder paste, using a typical SnPb solder profile will result in an unacceptable solder joint.
A series of design and material implementations have gained wide acceptance to address mechanical failures at the corners of area array packages. Current accepted levels of process strain were established when the dominant and limiting failure mode was interfacial fracture (IFF) in complex intermetallic compound (IMC) layers at the solder/package interface.

Full browser ?