BGA

(redirected from area array package)
Also found in: Encyclopedia.

BGA

Abbreviation for:
Bermuda grass allergen
blood-gas analysis
blood-group antigen
brilliant green agar

Mentioned in ?

blood-gas analysis

References in periodicals archive ?

Abstract: The study investigates the impact of silicone and Parylene conformal coatings, epoxy underfill materials and a silicone sealant on a variety of area array packages while being subjected to thermal cycling.

In case you missed it

For area array package repairs, medium wavelength IR systems provide ideal heat transfer and distribution, and are also flexible, user-friendly and cost-effective.

BGA Repair: Ensuring Process Control and Saving Money -- A medium wavelength infrared system can be used to quickly and economically repair a wide range of area array packages

Increased use of area array packages, chip scale packages and flip chips demands it.

An a-to-z guide to x-ray inspection: understanding x-ray inspection theory is essential when selecting a system

Area array packages with and without bumps have shown variations in performance and revealed the importance of placement pressure, placement speed and placement dwell in achieving low initial contact resistance.

In case you missed it

Abstract: Backward compatible mixed-alloy soldering has been carried out on area array packages with Pb-free bumps and eutectic SnPb soldering paste.

SMTA International: Microstructure and Reliability Studies of Mixed SnPb and Pb-free BGA Soldering

This is an issue for portable devices employing area array packages such as BGAs and CSPs.

In case you missed it

Abstract: Corner bond adhesive material has been widely used for improving shock performance of area array packages. Most of the studies focus on impact of material properties, such as CTE and Tg, on reliability at room temperature.

Component packaging

This is sufficiently accurate to detect fine-pitch components and all common area array packages.

Teradyne's 3-D x-ray inspection system: offers off-center tomosynthesis and a static wide-angle x-ray, for improved images

Abstract: Celestica has been conducting an ongoing testing program to assess Pb-free compatible materials and area array packages against the currently accepted levels of process strain.

In case you missed it

However, when building assemblies with area array packages containing SnAgCu balls with SnPb solder paste, using a typical SnPb solder profile will result in an unacceptable solder joint.

Mixed metallurgies: can SAC-finished components be soldered with SnPb? Sometimes

A series of design and material implementations have gained wide acceptance to address mechanical failures at the corners of area array packages. Current accepted levels of process strain were established when the dominant and limiting failure mode was interfacial fracture (IFF) in complex intermetallic compound (IMC) layers at the solder/package interface.