Abstract: The study investigates the impact of silicone and Parylene conformal coatings, epoxy underfill materials and a silicone sealant on a variety of area array packages while being subjected to thermal cycling.
Area array packages with and without bumps have shown variations in performance and revealed the importance of placement pressure, placement speed and placement dwell in achieving low initial contact resistance.
Abstract: Corner bond adhesive material has been widely used for improving shock performance of area array packages. Most of the studies focus on impact of material properties, such as CTE and Tg, on reliability at room temperature.
A series of design and material implementations have gained wide acceptance to address mechanical failures at the corners of area array packages. Current accepted levels of process strain were established when the dominant and limiting failure mode was interfacial fracture (IFF) in complex intermetallic compound (IMC) layers at the solder/package interface.