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Abstract: The study investigates the impact of silicone and Parylene conformal coatings, epoxy underfill materials and a silicone sealant on a variety of area array packages while being subjected to thermal cycling.
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Forward compatibility (ability to solder the components using lead-free solders and the appropriate higher temperature profiles) and backward compatibility (ability to solder the components using existing tin-lead solder and profiles), with the exception of area array packages with lead-free balls, which may not be backward compatible.
EMS Forum releases RoHS compliant component guidelines: guidelines for suppliers transitioning to RoHS compliant components (Rev. 1.1)
The boards for the area array packages, designed by StorageTek, had four components per board.
Are lead-free solder joints reliable? Judge for Yourself. A NEMI team found that lead-free manufacturing can be implemented without degrading solder joint reliability
Uniform heat distribution and transfer across the entire surface of the area array package and its land pattern on the PCB are critical.
BGA Repair: Ensuring Process Control and Saving Money -- A medium wavelength infrared system can be used to quickly and economically repair a wide range of area array packages
Increased use of area array packages, chip scale packages and flip chips demands it.
An a-to-z guide to x-ray inspection: understanding x-ray inspection theory is essential when selecting a system
Abstract: Backward compatible mixed-alloy soldering has been carried out on area array packages with Pb-free bumps and eutectic SnPb soldering paste.
SMTA International: Microstructure and Reliability Studies of Mixed SnPb and Pb-free BGA Soldering
This is an issue for portable devices employing area array packages such as BGAs and CSPs.
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Abstract: Corner bond adhesive material has been widely used for improving shock performance of area array packages.
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This is sufficiently accurate to detect fine-pitch components and all common area array packages.
Teradyne's 3-D x-ray inspection system: offers off-center tomosynthesis and a static wide-angle x-ray, for improved images
Abstract: Celestica has been conducting an ongoing testing program to assess Pb-free compatible materials and area array packages against the currently accepted levels of process strain.
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However, when building assemblies with area array packages containing SnAgCu balls with SnPb solder paste, using a typical SnPb solder profile will result in an unacceptable solder joint.
Mixed metallurgies: can SAC-finished components be soldered with SnPb? Sometimes

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