At a minimum, the entire chain of command should be using compatible TSOPs
, and TEWTs are a proven method of validating DSCA procedures.
OE Solutions and AimValley offer a cost-effective and low power alternative with the TSoP
Samples of Toshiba's TC58128FT 128Mb TSOP
device and the TC58128DC 16MB SmartMedia device, are available now priced at $28 and $31, respectively.
Uniframe stacks consist of individually tested and burned-in TSOP
devices that are linked by a lead-frame encompassing the module.
Smart SFP[TM] processes the OC-3/STM-1 signal fully transparent, maintaining payload structure, protection protocols and synchronization end-to-end; this simplifies the configuration and service turn-up of OC-3/STM-1 connections across a packet network," says Pieter de Boer, managing director at AimValley.
For the SAC 305, minor voiding was observed on tested J-leads and no voiding of TSOP
devices (Figure 2).
The device is housed in a 400 mil TSOP
type-II RoHS package.
The new chip will be available in a standard TSOP
package or in Intel's Easy BGA packaging in three densities from September priced at US$29.90 each in 1,000-unit quantities.
In addition, when using TSOP
or SOIC components, they should be placed such in a way that applying the solder paste printing can be accomplished lengthwise in the area of the component in order to prevent short circuits near the components' pins.
The most common burn-in sockets are for CSP, BGA, QFP, TSOP
and PLCC device packages.
has announced the 66-pin DDR TSOP
Chip Converter for its RAMCheck DDR Pro memory tester.
Industry standard JEDEC IC package outlines such as QFN, QFP, SOIC, BGA, CSP, TSOP
are all easily adapted to the concept of UDPo.