BGA

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BGA

Abbreviation for:
Bermuda grass allergen
blood-gas analysis
blood-group antigen
brilliant green agar
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References in periodicals archive ?
The fanout/routing technique takes into account such factors as ball pitch, land diameter, number of I/O pins, via type, pad size, trace width/spacing and the number of layers required to escape the microBGA.
It's not appropriate to have a traditional dog-bone fanout pattern for a microBGA because of its narrow pitch.
In order to make the design cost effective for fabrication, it is better to avoid blind/buried vias, but it really depends on the microBGA size and its pins assignment.
FIGURE 2C shows that the designer is able to fanout/route all microBGA pins with a regular 6 mil via size, in a minimum number of layers and without using any high-end fabrication technique.
The basic and most efficient way of utilizing decoupling capacitors is to place capacitors on the opposite side of the PCB with respect to the microBGA device and within the grid of vias and contacts used to route signal traces to the microBGA device.
Due to the small 0.4-mm pitch microBGA package size, it's not possible to use 0201 or bigger capacitor packages directly underneath the device.
However, this technique also has some disadvantages, such as increased constraints on the routing of signal traces within the microBGA grid, reduced reliability and increased cost.
During the component assembly process, the board can undergo different problems, especially if it contains fine pitch components like microBGAs. Many defects in microBGA packaging arise from an inappropriate re-flow profile.
Use of microBGA packages increases the level of design complexity.
A microBGA comes with considerable electrical and physical benefits.
This approach considerably helps to successfully finalize a microBGA project and achieve higher yield.
[1] Although the 20-mil pitch microBGA has good print performance with a 0.5 area ratio, Table 1 recommends area ratios of 0.55 or higher for E-FAB.