OPEN SOLDER JOINTS caused by lifting of a land grid array
(LGA) package during reflow are very common.
The products integrate the newest release of Cinterion's solderable Land Grid Array
(LGA) BGS3 module, which provides Internet communication over cellular networks.
X-ray inspection should be conducted after rework of any area array devices, land grid array
(LGA) or quad flatpack no-lead (QFN) components.
This model is a multi-chip module consisting of two high performance wideband amplifiers including off-chip bias circuitry assembled in a compact surface-mount land grid array
Active leadless components range from high-ball-count, fine-pitch area array ball grid array (BGA) to low-ball-count, odd-form BGAs, QFNs, and land grid array
QUAD FLAT NO lead (QFN) and land grid array
(LGA) packages often do not have solderable side terminations or are poorly solderable due to the component manufacturing process.
The miniature 0603 low current fuse uses thin film and land grid array
(LGA) technologies to enable precise control of the component's electrical and physical characteristics, which is not possible with standard fuse technologies.
The RDASW91 is a single-pole, nine-throw SP9T antenna switch packaged in a 2.5mm x 2.5mm, 16-pin land grid array
They feature a patented chip-scale, 40-pin land grid array
(LGA) package -- a process that Conexant was the first to commercialize for RF applications.
FIGURE 8 shows a land grid array
(LGA) with excessive voiding on three pads.