integrated circuit

(redirected from IC package)
Also found in: Dictionary, Thesaurus, Encyclopedia.

integrated circuit

a circuit, such as a computer chip, whose components are fabricated on a single semiconductor substrate.
References in periodicals archive ?
Industry standard JEDEC IC package outlines such as QFN, QFP, SOIC, BGA, CSP, TSOP are all easily adapted to the concept of UDPo.
Our focus is on System Integrity through the accurate modeling of highly integrated IC packages, printed circuit boards and systems, so our customers can achieve optimal performance and first pass manufacturing success.
The report describes Production Trends of Major IC Packages Assemblers (Substrate Material Type, Ball Pitch etc.
By connecting our HydroFlex interconnect directly to the IC package, discontinuities in the IC package are also bypassed, providing a high-performance signal path from die to die.
Because the package can have a substantial impact on silicon performance, the use of advanced IC packages is growing at a rate of 60 percent a year for BGAs (ball grid arrays) and at annual rates over 100 percent for CSP (chip scale package) implementations.
Named for the extraction of IBIS and SPICE circuit models of IC packages, XtractIM extracts the most common electrical models of IC packages according to IBIS, which is used to assess the electrical performance of IC packages.
Optimal Corporation, founded in 1995, is the leader in 3D power, signal and Thermal Integrity analysis for IC Package, System-in-Package (SiP) and PCB design.
Applications for Advanced IC Packages Cellular handsets are the primary handheld electronic gadget that everyone wants to own.
The design solutions are used to support all of ChipPAC's advanced IC packages including Ball Grid Array (BGA), Chip Scale (CSP), and Flip Chip.
For technology businesses and scientific institutions that need to evaluate small structures, Cascade Microtech delivers access to, and extraction of, electrical data from wafers, integrated circuits (ICs) IC packages, circuit boards and modules, MEMS, biological structures, electro-optic devices and more.
the market leader in power and signal integrity software solutions for integrated circuits, IC packages and printed circuit boards, today announced it has enhanced its PowerSI[TM] electrical analysis solution to enable parallel and distributed computing.
The single-head shaped beam produces more than 25,000 high-quality microvias per minute on advanced IC packages.