coefficient of thermal expansion

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coefficient of thermal expansion

The change in the dimensions of a material when its temperature is raised 1°C. In dentistry, if the relative expansion and contraction of restorative materials, casts, or appliances are not accounted for, the patient may have problems with improper fitting, microleakage, or adhesive debonding.
See also: coefficient
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(10) in the above system contain the coefficients of expansion of functions: [EI.sub.y], [kappa] [EI.sub.y], [[kappa].sup.2] [EI.sub.y], [GJ.sub.s], [kappa] [GJ.sub.s], [[kappa].sup.2] [GJ.sub.s] as well as the coefficients of expansion of their first and second derivatives.
The site covers broad subjects, such as applicable standards and National Electrical Code[R] articles, as well as specific details on metric equivalents, coefficients of expansion, and fire ratings.
They have different effective coefficients of expansion. Gages are particularly prone to exhibiting unexpectedly high effective thermal coefficients, due to their strange geometries, mixtures of components, electronic drift, and so on.
It is designed to seal at the interface between two dissimilar materials such as plastic and metal and to withstand these materials' differing coefficients of expansion at various temperatures.
The combination of a thermoset resin system and a woven glass reinforcement provides for a rigid laminate with low X and Y coefficients of expansion. The rigidity of the RO4000 laminate provides a firm platform suitable for pick-and-place or other forms of high volume manufacturing processes.
Expansion Differential - Different coefficients of expansion of materials within a slurry composition of a shell system can cause buckling or bulging.
As a toughened system, EP21TDCHT-LO is particularly suited for bonding dissimilar substrates, especially when they have differing coefficients of expansion.
As a flip chip fine "bumps" of solder are attached to the pads, and the wafer is flipped over for attachment to a circuit board.) The main problem with directly installing a silicon device on a standard fiberglass-type board (the most common known as FR4) is that the integrated component and the board have very different thermal coefficients of expansion. The traditional integrated circuit package served, among other tasks, to remove damaging stress from the silicon device.
Leitz has matched coefficients of expansion to make best use of ceramic, granite, carbon-fiber composites, and aluminum.
Opportunities exist, sparked by demographic shifts, affordability concerns, and rising labor costs, for new materials with improved fire performance, dimensional stability, high heat distortion temperatures, and designs that combine traditional materials such as wood, cellulose, and glass with polymers to reduce coefficients of expansion and provide moisture stability.
Able to handle temperatures up to 360[degrees]C, the materials used in the packages have matched coefficients of expansion. They are assembled using a glass-tometal seal process combined with gold germanium brazing, and can be sealed with metal or ceramic lids that have gold-tin solder preforms.
It calculates and outputs the temperature compensated measurement in real time, by applying pre-programmable coefficients of expansion. These can be displayed on a system control panel or fed to another instrument such as a column gage display.

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