In the semiconductor wafer
manufacturing process, an organic photoresist is used about thirty times as the wafer
rides through the process," he says.
In epitaxial silicon wafers
, the most common crystallographic defect is the epi stacking fault (ESF).
Holder and Contact Ring Seal: The Stratus successfully overcomes two critical, yet inherent technical limitations of traditional electroplating technology.
Reid, president and chief executive officer of Ibis Technology Corporation, said, "We are pleased that the SUMCO implanter has completed the final acceptance process, and we expect that SUMCO will begin using this tool for producing 300-millimeter SIMOX-SOI wafers
Our first lot of wafers
for mass production of DRAM using advanced 90 nm process technology started on October 17, 2005," said Shuichi Otsuka, president of Hiroshima Elpida.
Since that time, our engineers have worked very closely with the SUMCO engineers not only to complete the rigorous factory acceptance testing process, but to improve the quality and lower the cost of 300 mm SIMOX-SOI wafers
processed through the implanter.
is a privately owned company that delivers proprietary platform technology to accomplish 3D chip stacking and integration without the size and scalability limitations of conventional flip-chip and wire bond approaches.
designs, manufactures and markets wafer
handling solutions for the semiconductor industry, mechanical and odd-form component assembly solutions for the electronics industry, liquid handling solutions for the life sciences industry, and other automated handling, assembly and test solutions.
In order to expedite the implementation of this new product, Quartz Unlimited will sell the quartz wafers
directly to the chipmaking fabs worldwide.
In addition to the emergence of SoC flip chip products, the 300 mm wafer
format that is fast becoming the industry-standard more than doubles the number of die to be tested on flip chip device wafers
and places significant demands and challenges on semiconductor manufacturers' performance testing capabilities.
bumping technology offers complete solder paste bumping solutions for fine pitch devices, including 0.
These capabilities include automated wafer
-level defect classification (wafer
-level ADC), automated wafer
dispositioning, patented sampling strategies for faster yield learning, and the management and analysis of all-surface data collected from the wafer
's frontside, edge, and backside.