via

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vi·a

, pl.

vi·ae

(vī'ă, vī'ē; vē'ă),
Any passage in the body, as the intestine, the vagina, etc.
[L. way, road]

via

[vī′ə, vē′ä]
Etymology: L, a way
any passage or course, such as the esophagus or trachea.

via

(vē′ă) (vī′ă) plural.viae [L.]
Any passage in the body such as nasal, intestinal, or vaginal.

via

pl. viae [L.] way; channel.

Patient discussion about via

Q. what can I do in order to level my glucose count via diet or sport the fastest way?

A. If you want to lower your glucose levels then diet AND exercise will help you achieve this. If you need to raise your glucose levels then you can eat more, like eating some fruit, crackers, or other snacks.
Here is another website that may help:
BLOOD GLUCOSE: WHAT RAISES AND LOWERS IT?
http://www.emc.maricopa.edu/academics/physed/wellness/diet_diabetes.html

Hope this helps.

Q. hola amigos como estan yo estranando al amor de mi via que es monica la amo mchoy la estrano bastante hola soy un tipo muy feliz ya encontre el amor de mi vida nos casamos en diciembre tenemos muchos suenos ,un camino muy largo que recorrer pienso entregarme por completo al amor y dedicarnos el uno para el hotro ,yon amo ami baby estoy muy enamorado ella lo sabe es mi baby te amo mi gatita bebe

A. ¿Cuál es la pregunta?

More discussions about via
References in periodicals archive ?
We are delighted to close this deal with ALLVIA, a pioneer of 3D-IC technology since 1997, and the company that coined the industry term through-silicon via (TSV)," said Simon McElrea, president, Invensas Corporation.
The UniFire tool with its flexible application base and state-of-the-art performance enables our advanced packaging development, especially for through-silicon via processes," said Dr.
to present on "Laser Technology for Through-Silicon Via and Microvia Drilling in Silicon for 3D Packaging Applications" on March 9
This workshop will bring together representatives from device manufacturers, electronic design automation suppliers, semiconductor assembly and test service providers, and the R&D community to explore mechanical stress-driven failure mechanisms, their associated test vehicles, and the characterization and modeling methodologies pertaining to via-middle through-silicon via 3D stacking technologies.
and its innovative 3D through-silicon via (TSV) technology to develop a high-performance ADC/DSP platform that has applications in fiber optic telecommunications, high performance RF sampling and filtering, test equipment and instrumentation, and sub-array processing for phased array radar systems.
TOKYO & GRENOBLE, France -- CEA-Leti and SPP Process Technology Systems (SPTS) today announced they have agreed to develop advanced 300mm through-silicon via (TSV) 3D-IC processes at CEA-Leti's 300mm facilities in Grenoble, France.