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, pl.


(vī'ă, vī'ē; vē'ă),
Any passage in the body, as the intestine, the vagina, etc.
[L. way, road]


[vī′ə, vē′ä]
Etymology: L, a way
any passage or course, such as the esophagus or trachea.


(vē′ă) (vī′ă) plural.viae [L.]
Any passage in the body such as nasal, intestinal, or vaginal.


pl. viae [L.] way; channel.

Patient discussion about via

Q. what can I do in order to level my glucose count via diet or sport the fastest way?

A. If you want to lower your glucose levels then diet AND exercise will help you achieve this. If you need to raise your glucose levels then you can eat more, like eating some fruit, crackers, or other snacks.
Here is another website that may help:

Hope this helps.

Q. hola amigos como estan yo estranando al amor de mi via que es monica la amo mchoy la estrano bastante hola soy un tipo muy feliz ya encontre el amor de mi vida nos casamos en diciembre tenemos muchos suenos ,un camino muy largo que recorrer pienso entregarme por completo al amor y dedicarnos el uno para el hotro ,yon amo ami baby estoy muy enamorado ella lo sabe es mi baby te amo mi gatita bebe

A. ¿Cuál es la pregunta?

More discussions about via
References in periodicals archive ?
The majority of the 64 acquired patents and patent applications from ALLVIA relate to 3D-IC, including through-silicon via (TSV) technology and silicon interposer technology, which is often known as 2.
5D-IC, a form of 3D-IC integration, combines silicon interposer, microbump and through-silicon via (TSV) technologies to enable the integration of heterogeneous, multi-die systems in a single package.
The metrology tool successfully completed evaluation for development of through-silicon via (TSV) technology, projected to be a key enabling feature of next generation semiconductor device designs.
Silex Will Develop New Solutions for Through-Silicon Via Manufacture and Hermetic Wafer Bonding
Recently, DRIE is also being applied to through-silicon via (TSV) technology for 3D integration.
The metrology tool will be used in development of through-silicon via (TSV) technology, projected to be a key enabling feature of next generation DRAM designs.
Kromax will represent Alchimer's total through-silicon via (TSV) solution in Taiwan, including its Electrografting (eG) wet deposition technology.
to present on "Laser Technology for Through-Silicon Via and Microvia Drilling in Silicon for 3D Packaging Applications" on March 9