silicon chip


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silicon chip

A wafer of silicon with transistors and electronic microcircuitry etched on its surface, forming the highway on which data travels in a microprocessor.
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Step-by-step explanation of the silicon chip manufacturing process, complemented by a specially prepared video of the manufacturing process
The photons propagate in silica waveguides, much like in optical fibres, patterned on a silicon chip, and are manipulated with the electrode, resulting in a high-performance miniaturized device.
If you are interested in a virtual brochure, which provides manufacturers, end users, and other industry participants an overview of the latest analysis of the World Silicon Chip Fingerprint Markets, then send an e-mail to Sara Villarruel -- Corporate Communications at sara.
Rapidly rising security concerns over data protection in electronic and other digital products such as PCs, PDAs, and cell phones are fuelling the silicon chip fingerprint sensor market.
The Semiconductor Industry Association (SIA) applauded today's announcement by Ambassador Portman of an agreement to eliminate duties on multi-chip package (MCP) integrated circuits -- a semiconductor device that includes more than one silicon chip inside the package.
Peter Fromherz and Alfred Stett, physicists at the Max Planck Institute of Biochemistry in Munich, have made a silicon chip that can directly stimulate a nerve cell.
NYSE:MU) announced its support for today's finalization of a draft agreement to eliminate duties on multi-chip package (MCP) integrated circuits -- a semiconductor device that includes more than one silicon chip inside the package.
Built into a silicon chip, such a tiny "resonator" may someday serve as a simple electromechanical clock for electronic circuits or even as the basis for a miniaturized scanning tunneling microscope.
But the difficulty of fabricating such coils, or inductors, on a silicon chip has severely limited their use in electronic circuitry.
RSI customers currently using first generation labels and equipment will be offered a seamless migration path to Gen 2, as existing label formats will be based on the same form factor as first generation labels, with the only change being the silicon chip.
IBM's breakthrough enables the integration of different optical components side-by-side with electrical circuits on a single silicon chip using sub-100nm semiconductor technology.