intermetallic compound


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intermetallic compound

(in'tĕr-me-tal'ik kom'pownd),
a metal mixture that has a fixed chemical composition, or a narrow range for its composition when cooled from the liquid state. The atoms of one metal occupy definite positions in relationship to every point on the space lattice.

in·ter·me·tal·lic com·pound

(in'tĕr-me-tal'ik kom'pownd)
Phase formed on cooling of liquid metal solutions wherein the resulting phase has fixed chemical composition or narrow range of compositions.
References in periodicals archive ?
Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging.
With increasing concentration of aluminum elements, aluminum would react with the magnesium first on the surface and then form Mg-Al intermetallic compounds.
An explosion welding process uses high speed impact and despite of extremely short welding time (typically milliseconds) there is generated enough heat in the joint interface to produce melted areas and to form intermetallic compounds if the welded metals are prone to their creation.
A research team led by professor Kim Nak Joon, with Kim Han Soo and Kim Sang Hun, who is studying for a doctoral degree in the Steel Graduate School in POSTECH, developed a low-density steel that combines excellent strength and softness with low weight thanks to its use of intermetallic compounds.
SAC solder alloy contains three phases: a Sn-rich phase, and the intermetallic compounds (IMCs) [Cu.
OSAKA, JAPAN - Copper and nickel are "essential" elements in forming a stable intermetallic compound layer in lead-free soldering, a joint industry-academia study has found.
Detailed intermetallic compound analysis was also conducted.
Maximum global and local solder joint palladium weight percentages and cross-sectioned intermetallic compound morphology requirements were derived for high quality and reliability in a typical mil-aero application.
Aging of tin surface finishes occurs by intermetallic compound (IMC) formation at the tin/copper interface due to solid state diffusion.
Celestica has been conducting an ongoing testing program to assess Pb-free-compatible materials in combination with area array packages against the currently accepted levels of process strain established when the dominant and limiting failure mode was interfacial fracture in complex intermetallic compound layers at the solder/package interface.
Their intermetallic compound composition and morphology were investigated by SEM/EDX, and the crystallographic features of IMC determined by XRD.
TLPS processes rely on the combination of low-temperature melting alloy powders combined with higher-melting metal powders, which, when processed above the melting point of the lower temperature alloy, fuse to form a new intermetallic compound that will not re-melt at that same temperature but rather a much higher temperature.