2008) manufactured the three-layer boards with 100 percent black spruce hammer-milled
coarse particles in the core layer.
At the processing plant the chips are hammer-milled
to 8mm size, further dried by hot air (when necessary), and fed into extrusion presses.
6 mm), then hammer-milled to reduce the size of the wafers into particles.
One of the reasons for the high mechanical properties of hinoki and sugi boards was the shape and quality of the particles, which were waferized and hammer-milled to ensure a thin and relatively uniform configuration.