dissipation


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dissipation

(dĭs-ĭ-pā′shŭn) [L. dissipare, to scatter]
1. Dispersion of matter.
2. The act of living a wasteful and dissolute life, esp. drinking alcoholic beverages to excess.
References in periodicals archive ?
However, since temperature rise is a balance between heat generation and heat dissipation, and heat dissipation is a heat transfer process which is not a function of viscoelasticity, temperature rise predicted solely from viscoelasticity may become artificial when the degree of heat dissipation is comparable to heat generation.
Plastic packages can't handle the heat produced by die with high power dissipations," said StratEdge vice president of North American sales Casey Krawiec.
A Module Standby mode helps design engineers "fine tune" system dissipation by turning off via software on-chip peripheral functions when those functions aren't needed.
The explanation lies in hysteretic energy dissipation occurring during peeling.
During sleep mode, the clock and a large percentage of the circuits are suppressed to drastically reduce power dissipation.
This not only assures heat dissipation but also high performance in the X-band frequencies (9.
Because the device has a hard-wired data path, it provides deterministic performance with low power dissipation.
The heat dissipation components offered by Amulaire deliver the highest thermal performance available today, contributing to the size reduction of the traction drive electronics package, using technology we could not find anywhere else.
Geared towards meeting the growing market need for electronics packages with enhanced thermal dissipation requirements, the two companies are partnering to provide AlSiC packages incorporating diamond pins.
Supplying superior thermal dissipation, the new packages provide manufacturers of electronic devices, such as graphics processors, transportation power modules and military communication components, with dramatic device power and reliability improvements through extremely high thermal conductivity (1,200 W/m-K) paths and a tailored, low coefficient of thermal expansion (CTE).
The extremely low power dissipation of the entire E8400 solution allows it to be used in high density applications without the need for costly and exotic thermal management solutions.
As high-performance semiconductors generate more heat, and as shrinking circuit sizes accelerate an increase in power density, designers are challenged to develop heat dissipation solutions that are effective, practical and affordable.