direct bonding


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di·rect bond·ing

(di-rekt bonding)
Single-step intraoral procedure in which orthodontic attachments are bonded to teeth with resin.
References in periodicals archive ?
Porcelain laminates are also less likely to chip or stain--the two faults of direct bonding.
We believe that Ziptronix's patented direct bonding technology enables the industry's best performance for applications such as 3D memory, BSI image sensors and a developing host of other applications," said Dan Donabedian, CEO of Ziptronix.
ZOOM in-surgery whitening is available at Chapel House Dentistry for pounds 495, with the direct bonding layered system at pounds 50 per tooth.
Dan Donabedian, CEO of Ziptronix, said: "We believe that Ziptronix's patented direct bonding technology enables the industry's best performance for 3D memory.
The primary challenges are direct bonding between the barrier and the inner layer without the use of an applied adhesive; selection of the appropriate materials with the correct balance of performance properties; and a cost effective manufacturing process.
The atomic diffusion bonding technique is a direct bonding technique developed by Tohoku University's Professor Takehito Shimatsu.
the leading developer of direct bonding technology for advanced semiconductor applications, today announced that it has licensed its technology for a cell phone handset application.
the leading developer of direct bonding technology for advanced semiconductor applications, is showing strong potential for major cost savings in 3D memory applications, by replacing standard die-stacking methods with Ziptronix DBI([R] )wafer-stacking technology.
Among the company's many innovations are a number of notable "firsts," including direct bonding, rhomboid and computer-aided design (CAD) brackets, Copper Ni-Ti wires, TMA(TM) beta titanium wires, and Damon Clear(TM), the most aesthetic passive self-ligating bracket on the market.
Company's Patented Direct Bonding Technology Process Is Enhanced to Mount Antenna to Low-Frequency Micro-Sized Chips with a Surface Area of Less Than 0.
The soldering of the coil wires to the two pads of the device package is more robust and reliable compared to the direct bonding procedure.