While some studies have examined mold adhesion phenomenon
in IC packaging industry (1), (2), few have considered mold adhesion in the injection molding process.
slime in intimate association with the bacterial cell wall as shown by electron microscopy) only, which was responsible for resistance to multiple antibiotics and for the adhesion phenomenon
observed in the quantitative slime test.
In the die cutting sector have the "wear" complex as an abrasion phenomenon, adhesion phenomenon
, tribo-chemical reaction, surface destruction etc.
This analysis has attempted to view the adhesion phenomenon
in terms of general dielectric components, with attention to the specific example of metal to dielectric adhesion.