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solder

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sol·der

(sod'ĕr),
1. A fusible alloy used to unite edges or surfaces of two pieces of metal of higher melting point; hard solders, usually containing gold or silver as their main constituent, are usually used in dentistry to connect noble metal alloys.
2. To join two pieces of metal with such an alloy.
[L. solido, to make solid, through Fr., various forms]
Farlex Partner Medical Dictionary © Farlex 2012

sol·der

(sod'ĕr)
1. A fusible alloy used to unite edges or surfaces of two pieces of metal of higher melting point; hard solders, usually containing gold or silver as their main constituent, are frequently used in dentistry to connect noble metal alloys.
2. To join two pieces of metal with such an alloy.
[L. solido, to make solid, through Fr., various forms]
Medical Dictionary for the Dental Professions © Farlex 2012
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References in periodicals archive
The paste reflowed uniformly and covered leads per IPC-A-610D class 3 specifications.
Sealing the space between the CSP and substrate with liquid underfill makes it very difficult for volatiles from the CSP and substrate to escape during reflow. This is particularly true for lead-free CSP assembly, for which reflow temperatures are considerably higher.
The solder paste used was no-clean lead-free Sn3Ag0.5Cu (SAC 305) and the board was reflowed in convection oven with air atmosphere using a typical lead-free reflow profile.
Clinical implications of the "no reflow" phenomenon.
OSP cannot undergo more than two or three reflow cycles.
To wit, I noted some images showed where solder paste had not reflowed under the devices, and there was the presence of foreign object(s), such as discrete components, trapped under the package.
The via holes permitted flux volatile ingredients to outgas and escape during reflow, and for some of the flux residue to drain to the back side of the board.
Assembly trials used the following equipment: a fully automatic stencil printer capable of 12.5[micro]m alignments at 2 Cpk; an automated placement machine with a multi-station high-speed placement head with a high-resolution vision system; a multi-programmable zone reflow oven with nitrogen capability.
* Thermal soak is the time and temperature required to level temperature across the board before reflow. However, when temperature equilibrium is easily achieved due to simple boards and good oven heat transfer, this soak interval can he eliminated.
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