Substrate warpage as an assembly issue for flip chip on organic
interposers and silicon
interposers was an important topic discussed across many sessions as an assembly issue for flip chip on organic
interposers and silicon
interposers.
According to Figure 7, thru calibration is then performed by direct contact between the top and bottom probe tips in the absence of the silicon
interposer. In this manner, an equivalent thru standard can be set as a lossless and zero-delay line in its standard definition.
AGC has developed carrier glass technology that enables its customers to handle ultra-thin glass at their sites and micro-hole drilling technology to manufacture ultra-thin glass
interposers.
Asahi Glass needs the hole-fill technology of the Tucson, Arizona-based company to bring its ultra-thin
interposers into commercial production.
"Silicon
interposer technology is more than a bridge technology; it is a vital component for heterogeneous system integration.
It also provides high heat transfer rates directly at the chip surfaces, and avoids the detrimental effects of the contact resistance encountered with
interposers.
The test solutions are comprised of the Agilent 16962A logic analyser module and either a Nexus NT-DDR3DIHS or Nexus NT-DDR3SOIHS slot
interposer for next-generation, double-data rate (DDR3) SDRAM buses.
Close to 20 members of Japan's ASET program (the largest single contingent) presented developments related to co-simulation between the circuit simulation and electromagnetic simulation,
interposer technology, inspection, thin wafer singulation, as well as chip test technology for 300 mm wafers focused on contact and non-contact probe cards.
By combining Emulex's BR-2401-based multi-protocol tiered storage
interposer circuit board with its ETERNUS storage systems, Fujitsu enables customers to combine Fibre Channel and SATA disk drives within the same enclosure, allowing for maximum system flexibility, the company said.
The 28 papers cover fabricating the circuits; modeling, simulating, and scaling integrated devices; applications; through-wafer interconnects for packaging and
interposer applications; bonding technology; and enabling processes.
In addition, the Aficio MP 5500/MP 6500/MP 7500 Series enables users to create professional documents effortlessly with advanced finishing options such as a cover
interposer, a 100- sheet staple finisher, a booklet finisher, a Z-fold unit that cuts down over-sized documents to a more convenient size, and a two or three-hole punch unit.