ground

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ground

 [grownd]
1. a path of conduction from an electrical circuit to the earth.
2. to connect an electrical circuit or electrical equipment to the earth.
3. zero electrical potential.

ground

Etymology: AS, grund
1 (in electricity) a connection between the electric circuit and the ground, which becomes a part of the circuit.
2 (in psychology) the background of a visual field that can enhance or inhibit the ability of a patient to focus on an object.

ground

1. Basic substance or foundation.
2. Reduced to a powder; pulverized.
3. In electronics, the negative or earth pole that has zero electrical potential.

figure

A part or pattern in the visual field which has the perceptual attribute of completeness and is perceived as distinct from the rest of the field which forms the ground. Example: a printed word against a background page.
ambiguous figure An image or drawing arranged in such a way that its perception oscillates or flips involuntarily between, usually, two interpretations even though the retinal image remains constant, thus indicating that higher cortical processing are involved. Syn. reversible figure. See Blivet figure; Kanizsa figure; illusion; Necker cube; Rubin's vase; Schroeder's staircase.
Blivet figure An 'impossible' figure in which three apparently solid tubes are attached at one end of a rectangular base which projects only two bars (Fig. F4). See Necker cube; Schroeder's staircase; Rubin's vase.
fortification figure See scintillating scotoma.
Kanizsa figure An ambiguous figure in which the illusory contour of a square (or triangle) appears in the middle of four (or three) truncated solid squares (or circles). It is an illustration of the perceptual ability to make sense of an incomplete figure by creating a 'whole' image from the separate elements (Gestalt organization). Some people cannot perceive the contour. Syn. Kanizsa square (Fig. F5).reversible f. See ambiguous figure.
Fig. F4 Blivet figureenlarge picture
Fig. F4 Blivet figure
Fig. F5 Kanisza figureenlarge picture
Fig. F5 Kanisza figure
References in periodicals archive ?
The voltage across Lgnd, Vlg, is referred to as ground bounce.
Ground bounce is voltage created between two different points on the ground return path.
Ground bounce causes unwanted noise in the system and is more prominent with faster switching devices, or when there are more voltage swings (CMOS devices).
Decoupling capacitors are placed between the device and the stray inductance that can contribute to ground bounce.
Laboratory experiments show no ground bounce violations even with 100 percent I/O toggling demonstrating the excellent SSN immunity of Stratix II FPGAs.
Ground bounce is a transient voltage generated between two different points on the same ground path, such as a package lead, a connector pin or different locations on the ground plane of a circuit board.
PsiWinder is a clock network integrity (jitter) and critical path timing sign-off solution that considers the concurrent and interdependent effects of signal integrity (crosstalk noise) and power integrity (dynamic voltage drop and ground bounce, as well as package induced noise) on clock jitter and critical path timing.
1 software allows FPGA designers to analyze and optimize I/O pin placement and output switching characteristics to minimize undesirable noise and ground bounce on a PCB.
17 /PRNewswire/ -- Optimal Corporation, a leading provider of high-performance EDA solutions serving the semiconductor industry, today announced PowerGrid, a power integrity toolset for IR drop and ground bounce analysis of power distribution networks for integrated IC package and PCB co-verification.
The devices' latch-up immunity provides superior resistance to the ground bounce and negative input transients that cause false triggering in noisy environments.
Compared with alternative types of IC packaging, LFBGA technology improves ground bounce, signal undershoot, pin-to-pin skew, and signal propagation delay making it the most effective packaging solution for bandwidth intensive applications.
SIwave's full-wave, finite-element technique allows designers to characterize simultaneous switching noise (SSN), inter-symbol interference (ISI), power and ground bounce, resonances, reflections and coupling between traces and power/ground planes across the package and through the board.