BGA

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BGA

Abbreviation for:
Bermuda grass allergen
blood-gas analysis
blood-group antigen
brilliant green agar
References in periodicals archive ?
At stake is a big market: Total flip chip sales, including assembly, packaging and test, reached $16 billion in 2010, Yole said, good for 29% of the worldwide IC market.
These die placers, combined with recent advances in wire bonding equipment permitting extremely accurate wire length, loop height and loop shape control, permit COB with wire bonding to compete with flip chip in RF applications where the accuracy of the parasitic reactances at each I/O pad of the die is a factor in the overall design.
ASAT's flip chip LGA offers an exceptional solution for our multimedia products, and we are confident we will meet our customer needs for quality, performance and reliability.
Flip chip with no underfill is less of an issue, but either can be accommodated.
SCOPE OF REPORT The market for flip chip technology is segmented into following categories: -- Wafer bumping process: o Copper (Cu) pillar.
Phoenix Precision Technology, Taiwan's largest flip chip substrate supplier, will double its capacity to five million units per month by the end of February, according to Lin.
We established this factory in collaboration with Chartered Semiconductor Manufacturing and other Common Platform customers operating in Singapore to support the growing adoption of flip chip packaging for advanced silicon," said Oleg Khaykin, Amkor's executive vice president and chief operating officer.
Extending the Common Platform technology ecosystem to include collaboration on advanced wafer bump and flip chip processes is a natural step in our evolution to provide clients complete solutions," said Kevin Meyer, vice president of worldwide marketing and platform alliances at Chartered.
The market for flip chip technology is segmented into following categories:-- Wafer bumping process:o Copper (Cu) pillar.
The product protects lead-free flip chip devices and allows them to meet JEDEC Level 3/260[degrees]C moisture test requirements.
The Dip-Flux Feeder facilitates flip chip assembly by fluxing flip chips and other component types prior to placement.