BGA

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BGA

Abbreviation for:
Bermuda grass allergen
blood-gas analysis
blood-group antigen
brilliant green agar
References in periodicals archive ?
Yole, which is releasing a research report on flip chip market and technologies, noted lead will be banned in 2014, boosting Cu pillar.
Alternatively, an increase in functionality can be achieved by using a flip chip die on the lower package and stacking of a second die on top of the flip chip.
For flip chip die placement, this is usually augmented with an upward-looking camera to permit facedown alignment of the flip-chip pads with pads on the board.
We believe ASAT is the only semiconductor assembly and test company offering flip chip LGA technology in China," said Neil Mclellan, chief technology officer of ASAT Inc.
Polymer flip chip technology is overviewed along with design, process, electrical and mechanical reliability data.
Signetics offers a broad range of Flip Chip Packaging options that use industry standard bumping technologies as well as the finer pitch copper pillar bumping technology.
Without underfill, flip chip (with solder bumps) requires no change in the typical surface-mount process.
The final step in completing the flip chip process is to underfill the chip, as shown in Figure 2, thereby making a permanent connection.
The growth in laminate substrates has been driven by flip chip, which accounted for more than half of the revenue.
The growing adoption of flip chip packaging, coupled with the "Green" electronics movement, means that semiconductor manufacturers will increasingly turn to Pb-free wafer bumping technology.
Taipei -- Companies needing flip chip parts might do well to order them now.
In conjunction with its exiting probe and test facility in Singapore, Amkor now offers Singapore customers a complete suite of wafer bump, probe and final test services to support emerging flip chip applications using Common Platform advanced silicon at the 90nm and 65nm process nodes.